Seminar courses open window into
MEMS technology and its business side
Emily M. Smith
ASME's annual MEMS Technology Seminar is scheduled
to take place June 17-19 at the Hyatt Regency in Cambridge, Mass.
The seminar is for mechanical engineers and researchers, chemical engineers
and chemists, electrical engineers, government and private laboratoriezs,
manufacturers, research and development firms, as well as investment
and financial executives.
During the seminar, four courses will be offered: BioMEMS, MEMS Packaging,
Microfluidics and Lab on a Chip, and Photonics. A brief outline of each
In BioMEMS, attendees will gain an in-depth understanding of biomedical
MEMS. The course will begin with an introduction to the microelectromechanical
field and a tutorial on the fundamentals of MEMS device fabrication.
Attendees will get detailed insight into bioMEMS and the unique features
of these micromachines in terms of design, materials and fabrication
techniques. Specific application areas will also be covered in detail,
such as implantable drug delivery, biomimetic interfaces, tissue engineering
and microsurgical tools.
The commercialization of bioMEMS will also be discussed, along with
the biocompatibility aspects of bioMEMS, systems integration issues
and future directions of the field.
The course directors are Abraham Lee, a professor at the Center for
Biomedical Engineering, University of California, Irvine, and Gisela
Lin, a sales engineer with the BioMEMS Business Unit of Standard MEMS
The MEMS Packaging course will provide basic and advanced packaging
topics and solutions for various MEMS devices. An overview of MEMS manufacturing
technologies and related packaging issues will be given at the beginning
of the course.
Specific MEMS packaging requirements and solutions for key MEMS commercial
will then be addressed by experienced researchers from various industry
Hermetical sealing, accelerated testing and vacuum encapsulation skills
will also be discussed in this course, along with advanced approaches
for MEMS packaging and assembly, integration issues and future directions.
The course director will be Liwei Lin, an associate professor of mechanical
engineering at the University of California, Berkeley.
Although Microfluidics is an enabling technology that can have a strong
impact on biochemical analysis on chips, researchers need to understand
the behaviors of fluid flow in nano/micro channels, which differ greatly
from the macro scale.
This course will cover the fundamentals of microfluidics for beginners
to the applications of microfluidics for end users. Course participants
will learn designing, modeling, fabricating and characterizing microfluidic
components. That will be followed by training in the application of
fundamental concepts of microfluidics to practical lab-on-a-chip, DNA/
protein chips and clinical diagnostic biochips.
Chong H. Ahn, who is director of microsystems and bioMEMS at the University
of Cincinnati, will be the course director.
Although microelectronic and photonic packaging typically involves electrical
and optical engineers, mechanical and materials engineers can be equally
successful in both fields, once they learn how to apply methods of mechanical
and materials engineering to this area and understand the mechanical
and reliability problems encountered in microelectronics and photonics.
Upon completing the Photonics and Lab on a Chip course, participants
will be able to better understand the reliability problems in, and mechanical
behavior of, typical microelectronics, optoelectronics and photonics
structures subjected to thermally induced, mechanical or dynamic loading.
The course will provide simple and easy-to-apply formulas that can be
used during the design process. These formulas indicate the roles of
different materials and geometrical factors affecting the mechanical
behavior and reliability of a packaging structure, and can be effectively
used prior to, and often instead of, computer-aided modeling or experimental
Ephraim Suhir, who is a vice president of reliability and packaging
at Iolon Inc., and the founder and editor-in-chief of ASME's Journal
of Electronic Packaging, will be the course director.
All courses begin at 8:30 a.m. and end at 4:30 p.m., except Photonics,
which begins at 8 a.m. A daily luncheon is included.
The per-course cost to attend is $1,295 for members and $1,445 for nonmembers.
The cost will be $1,095 for members who are academics and $1,245 for
For information about the course instructors, the daily schedule for
the seminar, or to register, visit www.asme.org/education/techsem/mems.htm
or call (800) 843-2763 or e-mail Jennifer Burns, firstname.lastname@example.org.
Tabletop exhibits and sponsorships are also available during the MEMS
Technology Seminar. Current exhibitors and sponsors include Corning
IntelliSense and Lab-on-a-Chip.com.
For more information, visit www. asme.org/education/techsem/ mems.htm
or contact Jennifer Burns at email@example.com.
Cited from ASME